NC-OO 0.89MM 30M (MULTICORE / LOCTITE)
Демонтажная оплетка, не требует очистки, антистатическая, медь с флюсом, 0.8мм x 30м
The NC-OO 0.89MM 30M is a no clean Desoldering Wick designed for static-free desoldering and repair of PC boards without the need for subsequent cleaning. Multi-core no clean wick uses a special halide-free vacuumised no-clean, flux-coated copper braid designed to improve wicking. It will not lose its efficiency even after prolonged storage in humid conditions. The wick remains flexible and will not flake. PC boards meet MIL-P-28809A cleanliness test without cleaning. The Multicore no clean wick over the solder requiring removal and place the soldering iron tip on top of the copper braid. The braid and solder beneath will gradually heat until the solder melts and is absorbed into the braid by capillary action. Remove the braid, cut-off the solder-filled length and dispose of lead contaminated copper properly.
- Faster and increased solder absorption
- Wound on static dissipative spools
- PCBs will meet MIL-P-28809A cleanliness test without cleaning
- Negligible residues which are non-corrosive, clear and non-hygroscopic
- Heat stable coating
- Excellent shelf life
Области применения
Техническое Обслуживание и Ремонт
Длина:
30м
Линейка Продукции:
-
Материал Оплетки:
Покрытая Флюсом Медь
SVHC (Особо Опасные Вещества):
No SVHC (27-Jun-2018)
RoHS статус:
Да
Ширина:
0.89мм