EZ430-T2012 (TEXAS INSTRUMENTS)

F1359259
нет данных
 
Макетная плата, MSP430 USB палочка F2012 плата, 3 целевых платы eZ430-T2012 с 4-контактным разъемом

Документация
Technical Data Sheet EN
  element14 Technical Page (153.15KB) EN

БрендTEXAS INSTRUMENTS НаименованиеEZ430-T2012 Цена заШтука Страна производстваNetherlands СкладFarnell

Макетная плата, MSP430 USB палочка F2012 плата, 3 целевых платы eZ430-T2012 с 4-контактным разъемом

The EZ430-T2012 is a MSP430 USB stick F2012 board, which includes three MSP430F2012 based target boards for the eZ430-F2013 development tool. The eZ430-F2013 development tool provides hardware and software to evaluate the MSP430F2013 and develop a complete project in a convenient USB stick form factor. The eZ430-F2013 supports the Code Composer Studio and IAR Embedded Workbench Integrated Development Environments to provide full emulation with the option of designing with a stand-alone system or detaching the removable target board to integrate into an existing design. The USB port provides enough power to operate the ultra low power MSP430 so no external power supply is required. The T2012 can be used to develop your personal project or to evaluate the MSP430 MCU. The T2012 gives you all the same capabilities and peripherals of the MSP430F2013 on the eZ430, but includes a high speed, eight channel 10bit ADC.
  • Three eZ430-T2012 target boards with a 4 pin connector to fit the eZ430-F2013 USB development tool
  • EZ430 development tool provides debugging and programming interface for MSP430F2012 on target board
  • Fully accessible pins
  • LED indicator to check the status
  • Easy to use IAR embedded workbench integrated development environment

Области применения

Встроенные Конструкции и Разработка, Связь и Сеть

Архитектура Ядра:
MSP430
Количество Бит:
16бит
Линейка Продукции:
-
Название Семейства Чипа:
MSP430F2xx
Номер Ядра Чипа:
MSP430
Подархитектура Ядра:
MSP430
Производитель Чипа:
Texas Instruments
Содержимое Комплекта:
Плата
SVHC (Особо Опасные Вещества):
No SVHC (27-Jun-2018)