A15959-02 (LAIRD)
Термопрокладка, TFlex серия HR400, 1.8Вт/м.К, силиконовый эластомер, 0.5мм, 229мм
The A15959-02 is a 0.5mm Thermal Gap Filler with excellent thermal performance and great handling for mass-production applications. The low modulus interface pad conforms to component topography, resulting in little stress on the components, mating chassis or parts. The softness relieves mechanical stress from high stack-up tolerance and absorbs shock, resulting in improved device reliability. Tflex™ HR400's recovery properties for applications requiring material rework result in continued mechanical integrity even after device rework and re-assembly. It is naturally tacky on both sides and requires no additional adhesive coating to inhibit thermal performance. The tack is designed to hold the pad in place during assembly and component transport. It is suitable for cooling components to chassis, frame or other mating components, memory modules, home and small office network equipment, mass storage devices, radios, LCD/PDP flat panel TV, set top boxes, IT infrastructure applicatio
- Mid-performance gap filler
- Electrically insulating
- Soft and compliant
- Naturally tacky for adhesion during assembly and transport
- UL94V-0 Flammability rating
- -50 to 160°C Operating temperature
Области применения
Управление Теплом, Аудио, Авто, Связь и Сеть, Светодиодное Освещение
Внешняя Длина:
229мм
Внешняя Ширина:
229мм
Линейка Продукции:
TFlex HR400 Series
Проводящий Материал:
Силиконовый Эластомер
Тепловой Импеданс:
-
Теплопроводность:
1.8Вт/м.K
Толщина:
0.5мм
Электрическая Прочность Диэлектрика:
-
SVHC (Особо Опасные Вещества):
No SVHC (15-Jan-2018)
RoHS статус:
Да