A15336-01 (LAIRD)
Тепловая прокладка, серия Tflex 300, 1.2Вт/м.К, силиконовый эластомер, 4мм, 229мм
The A15336-01 is a 4mm Thermal Gap Filler with unique silicone gel offers compliancy and thermal resistance at pressures of 50psi will deflect to over 50% the original thickness. This high rate of compliancy allows the material to totally blanket the component, enhancing thermal transfer. The material has a very low compression set enabling the pad to be reused many times. Tflex™ 300, in achieving its stellar compliancy, does not sacrifice thermal performance. With a thermal conductivity of 1.2W/mK, low thermal resistances can be achieved at low pressures. Tflex™ 300-H is offered with a hard, metalized liner option for easy handling and improved rework. The metalized liner's lower coefficient of friction also allows for easy assembly of parts that must slide together, such as a card into a chassis. It is suitable for flat panel displays, memory modules, set top box, lighting ballast, handheld electronics, optical disk drives and vibration dampening applications.
- Extreme compliancy allows material to totally blanket components
- Low compression set enables the pad to be reused many times
- UL94V-0 Flammability rating
- -40 to 160°C Operating temperature
- ±10% Thickness tolerance
- 0.56% Out-gassing TML
- 0.10% Out-gassing CVCM
- 600ppm/c Coefficient thermal expansion (CTE)
Области применения
Управление Теплом, Связь и Сеть, Компьютеры и Периферия, Управление Питанием, Освещение, Светодиодное Освещение, Авто
Внешняя Длина:
229мм
Внешняя Ширина:
229мм
Линейка Продукции:
Tflex 300 Series
Проводящий Материал:
Силиконовый Эластомер
Тепловой Импеданс:
-
Теплопроводность:
1.2Вт/м.K
Толщина:
4мм
Электрическая Прочность Диэлектрика:
-
SVHC (Особо Опасные Вещества):
No SVHC (15-Jan-2018)
RoHS статус:
Да