GP2200SF-0.020-02-0404 (BERGQUIST)

The GP2200SF-0.020-02-0404 is a thermally conductive silicone free Gap Filling Pad specially designed for silicone-sensitive applications. The material is ideal for applications with uneven topologies and high stack-up tolerances. Gap Pad 2200SF is reinforced for easy material handling and added durability during assembly. The material is available with a protective liner on both sides. Gap Pad 2200SF is supplied with reduced tack on one side allowing for burn-in processes and easy rework.