SW16015 (CHEMTRONICS)
Демонтажная оплетка, Soder-Wick®, не требует очистки, токорассеивающая катушка, 0.9мм x 5футов
The SW16015 is a Soder-Wick® No Clean Desoldering Braid designed to provide fast and safe desoldering without leaving behind harmful flux residues. Soder-Wick® No Clean uses pure, oxygen-free copper braid and a patented flux technology to make an efficient and effective desoldering braid. Soder-Wick® No Clean SD is available on ESD safe bobbins for protection against damage due to static electricity. The Soder-Wick® No Clean SD safely removes solder in all applications requiring type ROL0 flux. BGA braid sized and designed specifically for BGA pad and chip rework/repair so entire BGA pads cleaned in three to four passes. The Soder-Wick® No Clean safely removes solder from micro circuits, surface mount device pads, ball grid array pads, lugs and posts.
- White label on SD bobbin
- Minimizes the risk of damage associated with static electricity
- Patented non-corrosive, halide-free and organic no-clean flux
- Desolders up to 40% faster than competitive no-clean braids and leaves boards cleaner
- Requires little or no post solder cleaning
- No corrosive residues
- Minimal risk of heat and static component damage
- Meets Bellcore TR-NWT-000078 and ANSI IPC SF-818 for surface insulation resistance
- Packaged in ESD-safe static dissipative bobbins
Области применения
Техническое Обслуживание и Ремонт
Длина:
1.524м
Линейка Продукции:
-
Материал Оплетки:
Медь без Кислорода
SVHC (Особо Опасные Вещества):
No SVHC (12-Jan-2017)
RoHS статус:
Да
Ширина:
0.8мм
