HERNON 746 SET-04 (SEPA)

The HERNON 746 SET-04 is a Thermal Conductive Adhesive and Activator. The HERNON 746 is an excellent thermally conductive two-component adhesive with extremely fast curing. It offers effective thermal bonding of electronic components to heat sinks. The material has an outstanding bonding property so that mechanical devices are no longer required. The adhesive comprises a paste-like adhesive and a fluid activator. The components are not mixed. Apply a small amount of the adhesive to the surface to be bonded and the activator to the other bonding surface. Press together to bond. Necessary corrections can be made within 15 to 30 seconds. The bond is secure after 5 minutes at room temperature and is fully cured within 24 hours. HERNON 746 bonds heat sinks to components and parts.